封装微带电路网络特性的矩量法分析
The Network Characteristic Analyses of the Packaged Microstrip Circuits by Using MoM
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摘要: 该文首先对封装微带电路建立了以混合位积分方程(MPIE)描述的矩量法(MoM)分析模型,采用了复镜像技术,准确计算了Green函数并表达为简洁闭式。进而考虑了边壁对电路的影响,计算并修正了阻抗矩阵。在此研究的基础上,该文将Eleftheriades(1996)中的模型扩展为封装模型,提取出封装微带电路的网络特性,最后的数值结果表明封装效应对微带电路的网络特性有着很重要的影响。Abstract: In this paper, a Method of Moments (MoM) model of packaged microstrip circuit is presented, which is described by Mixed Potential Integral-Equation (MPIE). The Greens functions of a horizontal electric dipole for the covered microstrip circuits can be expressed as the closed form by the Discrete Complex Image Method (DCIM). Then the influence of the enclosure side walls is considered by the equivalent image currents and the impendence matrix is modified further. Finally, the Eleftheriades(1996) model is extended to package model and the packaged microstrip network characteristics are extracted. The numerical results show the package effect could make an important difference on the network characteristics of the microstrip circuits.
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