摘要:
本文介绍了进行高铅玻璃通道电子倍增器(CEM)稳定性试验的方法与结果,得到了总累计计数约1011的寿命数据。用俄歇电子能谱仪分析了疲劳的CEM的活性表面结构与成份,发现了寿命试验过程中活性表面上碳的增加是CEM增益下降的主要原因,碳层的厚度约为50左右。为了提高CEM的耐烘烤性能,我们还研究了烘烤温度对增益和分辨率的影响,以及烘烤温度与还原温度的某些关系,发现在保持一定电阻率的条件下,还原温度越高,CEM的耐烘烤温度也越高。
Abstract:
A method to test the stability of high lead glass CEM is made and some results are obtained. The life test datum with an accumulative count about 1011 is obtained; The stru-cture and composition of active surface of fatigued CEM are analyzed by using AES. We find the increase of carbon on the active surface is the main cause for the decrease of the CEM gain through the life test. The thicknese of contaminating carbon layer is approximately 50. In order to improve CEM s bake-resisting property, we have also studied theeffects of the baking temperature on the gain and FWHM, and the relationhip between the baking temperature and the reduction temperature. we find, on condition of keeping the resistivity constant at a certain time, the higber the reduction temperature, the higher the bake-resisting temperature is.
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