Wafer-Level Adaptive Testing Method with Low Test Escape
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摘要: 为了降低集成电路中测试成本，提高测试质量，该文提出一种低测试逃逸率的晶圆级适应性测试方法。该方法根据历史测试数据中测试项检测故障晶粒的有效性筛选测试集，降低待测晶圆的测试成本。同时，分析晶粒邻域参数波动程度，将存在波动晶粒的参数差异进行放大并建模，提高该类晶粒质量预测模型的分类准确率；无波动的晶粒使用有效测试集建模的方法进行质量预测，减少测试逃逸的风险。根据实际晶圆生产数据的实验结果表明，该方法可以明显降低晶圆的测试项成本40.13%，并保持较低的测试逃逸率0.0091%。Abstract: In order to reduce the test cost and improve the test quality in ICs. A wafer-level adaptive test method with low test escapes is proposed. The method reduces the test cost of wafers to be tested by filtering the test set based on the effectiveness of the test item to detect faulty die in historical test data. At the same time, the degree of fluctuation of the parameters in the neighborhood of the die is analyzed, and the parameter differences of the die with fluctuations are amplified and modeled to improve the classification accuracy of the quality prediction model for this type of dies; The dies without fluctuations are used for quality prediction using the valid test set modeling method to reduce the risk of test escapes. Experimental results based on actual wafer production data show that the method can significantly reduce the test item cost of wafers by 40.13% and maintain a low test escape rate of 0.0091%.
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