Amplifying Circuit Interface Model for LiDAR Signal Processing Systems
-
摘要:
应用于激光雷达(LiDAR)测量系统的单芯片全集成信号处理电路系统的设计与实现，对于有效提高激光雷达整机测量精度、数据率，缩短测量时间，减小测量设备体积和功耗具有重要的意义。考虑到目前对于信号处理电路系统的研究中较少考虑芯片在实际使用环境中的接口问题，基于光电探测器、裸芯片、封装、传输线及测试板等诸多接口影响因素，运用协同仿真分析的方法，在电路系统的实际工作频段内，建立了一种精确的、能反映激光雷达信号处理电路系统放大电路芯片真实应用环境的接口一体化仿真模型，并通过S参数仿真对其进行验证。同时基于CMOS工艺，将设计得到的放大电路系统进行流片，在芯片输入端承载不同光电探测器寄生负载的情况下，对芯片性能进行测试，仿真结果与测试结果吻合较好，验证了该接口模型建立的可行性。
Abstract:The monolithic signal processing circuit system for Light Detection And Ranging (LiDAR) measurement has significant practical values in terms of improving LiDAR measurement accuracy and data rate, shortening measurement time, and reducing equipment size and power consumption. As the environment interface problem is less considered, the appropriate input interface model must be established to break through the technology difficulty to associate circuit system with photodetectors, die chip, package, transmission line, test board and so on in the operating frequency range. By the combination of theoretical analysis and model simulation, the real working environment of circuit systemfor LiDAR signal processing can be simulated reasonably. Furthermore, based on CMOS technology, the signal processing circuit chip is tested with different photodetector parasitic capacitances. The well agreements between simulation and the testing results validate the feasibility of the input interface model.
-
XUE Zhaofeng, LI Zhiqun, WANG Zhigong, et al. A low noise, 1.25 Gb/s front-end amplifier for optical receivers[J]. Chinese Journal of Semiconductors, 2006, 27(8): 1373–1377. WANG Yangjie, KHAN M Z, and RAUT R. A fully differential CMOS limiting amplifier with active inductor for optical receiver[C]. 2005 Canadian Conference on Electrical and Computer Engineering, Saskatoon, Canada, 2005: 1751–1754. LIU Jinbin, GU Ming, CHEN Hongda, et al. A CMOS front-end circuit for SONET OC-96 receiver[C]. 2006 International Conference on Communications, Circuits and Systems, Guilin, China, 2006: 1961–1965. HUANG Hueiyan, CHIEN Junchau, and LU Lianghung. A 10-Gb/s inductorless CMOS limiting amplifier with third-order interleaving active feedback[J]. IEEE Journal of Solid-State Circuits, 2007, 42(5): 1111–1120. doi: 10.1109/JSSC.2007.894819 博耀威, 孟宪佳. 光电子集成芯片技术发展现状与趋势[J]. 科技中国, 2017(8): 1–3. doi: 10.3969/j.issn.1673-5129.2017.08.002BO Yaowei and MENG Xianjia. Development status and trend of optoelectronic integrated chip technology[J]. China SciTechnology Business, 2017(8): 1–3. doi: 10.3969/j.issn.1673-5129.2017.08.002 广东省政府发展研究中心创新产业研究处. 广东集成电路(芯片)产业发展研究报告[J]. 广东经济, 2018(11): 6–27.Innovation Industry Research Office of Guangdong Provincial Government Development Research Center. Research report on the development of integrated circuit (chip) industry in Guangdong[J]. Guangdong Economy, 2018(11): 6–27. 丁春南, 叶茂, 夏显召, 等. 面向LiDAR应用的APD单片前端读出电路设计[J]. 红外与激光工程, 2019, 48(S1): S106004.DING Chunnan, YE Mao, XIA Xianzhao, et al. Monolithic front-end readout circuit for LiDAR using APD detector[J]. Infrared and Laser Engineering, 2019, 48(S1): S106004. 陈肖, 周东. APD阵列激光成像雷达处理电路的研究进展[J]. 激光与红外, 2015, 45(9): 1018–1022. doi: 10.3969/j.issn.1001-5078.2015.09.002CHEN Xiao and ZHOU Dong. Development of processing circuit of laser imaging radar based on APD array[J]. Laser &Infrared, 2015, 45(9): 1018–1022. doi: 10.3969/j.issn.1001-5078.2015.09.002 高科, 孙晶华. 光电探测器前置放大电路研究[J]. 微型机与应用, 2011, 30(18): 86–88. doi: 10.3969/j.issn.1674-7720.2011.18.031GAO Ke and SUN Jinghua. Research in the front end circuit of photo-electric detector[J]. Microcomputer &Its Applications, 2011, 30(18): 86–88. doi: 10.3969/j.issn.1674-7720.2011.18.031 ZHI yangxiang. Research on laser ranging technology based on flight time[D]. [Master dissertation] Shaanxi Normal Universit. 郑锐. 15 Gb/s CMOS单片集成并行传输光接收前端放大器设计[D]. [硕士论文], 东南大学, 2006.ZHENG Rui. 15 Gb/s CMOS monolithic parallel front-end amplifier for optical receiver design[D]. [Master dissertation], Southeast University, 2006. 李久, 何进, 童志强, 等. 10Gb/s光接收机跨阻前置放大器芯片设计研究[J]. 半导体光电, 2017, 38(4): 562–565.LI Jiu, HE Jin, TONG Zhiqiang, et al. Study on design of the transimpedance preamplifier chip for 10 Gb/s optical receiver[J]. Semiconductor Optoelectronics, 2017, 38(4): 562–565. TIAN guangkun,Fan rudong, et al. High speed circuit PCB design and EMC Technology Analysis[M]. Beijing: Electronic Industry Press: 65–67 陈佳楠. 共面波导及微带线弯曲结构的时域仿真与研究[D]. [硕士论文], 南京邮电大学, 2015.CHEN Jianan. Time domain simulation and study of bending coplanar waveguide and microstrip[D]. [Master dissertation], Nanjing University of Posts and Telecommunications, 2015. 鲜飞. QFN封装元件组装工艺技术研究[J]. 电子元件与材料, 2005, 24(11): 52–55. doi: 10.3969/j.issn.1001-2028.2005.11.018XIAN Fei. Research on QFN soldering and assembly[J]. Electronic Components &Materials, 2005, 24(11): 52–55. doi: 10.3969/j.issn.1001-2028.2005.11.018 史建卫. QFN封装元件组装及质量控制工艺[J]. 电子工业专用设备, 2015(2): 21–30. doi: 10.3969/j.issn.1004-4507.2015.02.007SHI Jianwei. QFN packing device assembly and quality control process[J]. Equipment for Electronic Products Manufacturing, 2015(2): 21–30. doi: 10.3969/j.issn.1004-4507.2015.02.007 曾耿华, 唐高弟. 微波多芯片组件中键合线的参数提取和优化[J]. 信息与电子工程, 2007, 5(1): 40–43. doi: 10.3969/j.issn.1672-2892.2007.01.009ZENG Genghua and TANG Gaodi. Parameters extraction and optimization of bondwire in MMCM[J]. Information and Electronic Engineering, 2007, 5(1): 40–43. doi: 10.3969/j.issn.1672-2892.2007.01.009 Thorlabs products[EB/OL]. https://www.thorlabschina.cn/navigation.cfm?guide_id=36, 2019. First Sensor products[EB/OL]. https://www.first-sensor.com/cn/products/optical-sensors/detectors/avalanche-photodiodes-apd/, 2019. -
下载:
计量
- 文章访问数: 3136
- HTML全文浏览量: 1227
- PDF下载量: 132
- 被引次数: 0
