场发射锥尖的制备及特性研究
FABRICATION AND CHARACTERISTICS OF FIELD EMISSION ARRAYS
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摘要: 研究了倒金字塔填充型锥尖及正向刻蚀硅尖的制备工艺,采用了两种封装结构测试了场发射硅尖阵列的发射特性,并分析比较了这两种结构的特点及用于制备高频微波器件的可能性。
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关键词:
- 场致发射锥尖阵列; 键合; 微波器件
Abstract: Field emission arrays are important to vacuum microelectronic microwave devices. The downward pyramid filled cone and upward etched silicon cone are fabricated. Two kinds of packing structures are used and the emission properties of these cones are tested. The characteristics of these structures and the application for microwave devices are analyzed. -
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