用堆集掩模技术制造变厚超导微桥
FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE
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摘要: 本文介绍了一种制作变厚超导微桥的新方法。用此方法变厚超导微桥通过一次光刻、用三个坩埚、不必打开镀膜机就能制成。利用普通接触式紫外曝光设备和斜蒸发技术,使桥区达到亚微米尺寸。并获得了无迴滞的直流I-V特性。
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关键词:
Abstract: A pile-up masking technique using the conventional optical lithography and a two-step or three-step evaporation process is developed to fabricate the variable thickness superconducting microbridges of submicron. The l-V characterise of the microbridges made by the technique is measured at 4.2 k. -
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