Abstract: A new microstrip vertical transition based on the via in multilayered printed circuit board is proposed for Ultra Wide-Band (UWB) communication. The planar electromagnetic band-gap unit is etched on power plane around the vias to suppress resonance and reduce self impedance of the Power Distribution Network (PDN), and then transmission performance is improved. The interconnect structure is decoupled into microstrip mode and power ground pair mode which coupled in the vias. The network analysis method is used to estimate system performance efficiently. The simulated and measured results show that the proposed transition has an insertion loss of 0.4 dB across the frequency band 3.1-10.6 GHz. By comparison with the method of adding shorting vias between PDN, the proposed structure in this paper benefits of low cost for one less routing layer with considerable performance.