|
Dambach J, Ahmad M, Cashier P, and Regnier K.Development of a 10Gb I/O connector system, DesignCon2005 [C], Santa Clara, California, 2005: 31/1-3/2.Resso M, Minger R, Roe J, and Gneiting T. Investigatingmicrovia technology for 10Gbps and higher telecommunicationsystem, DesignCon2005 [C], Santa Clara, California, 2005:31/1-3/2.[2]Jong J M, Janko B, and Tripathi V. Equivalent circuitmodeling of interconnects from time-domainmeasurements[J].IEEE Trans. on Components, Hybrids, andManufacturing Technology.1993, 16(1):119-126[3]McGibney E and Barrett J. An overview of electricalcharacterization techniques and theory for IC packages andinterconnects [J]. IEEE Trans. on Advanced Packaging, 2006,19(1): 131-139.[4]Deutsch A, Surovic C W, Campbell J C, Coteus P W,Lanzetta A P, Holton J T, and Knight A D. Electricalcharacteristics of high-performance pin-in-socket andpad-on-pad connectors[J]. IEEE Trans. on AdvancedPackaging., 1997, 20(1): 64-77.[5]Kao C H, Tseng C C, Ming F, and Lai M F. A BetterTechnique using multisegment modeling and analysis ofhigh-density and high-speed connector [J].IEEE Trans. onAdvanced Packaging.2006, 29(1):140-148[6]Tripathi A and Tripathi V K. A configuration-orientedSPICE model for multiconductor transmission lines in aninhomogeneous medium[J].IEEE Trans. on MicrowaveTheory and Techniques.1998, 46(12):1997-2005
|
下载:
