螺旋线镀膜对慢波组件散热性能影响的研究
doi: 10.3724/SP.J.1146.2007.00137
Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit
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摘要: 该文研究了镀膜螺旋线的使用对慢波组件散热性能的影响。估算了采用镀膜螺旋线后，组件散热能力的改善情况。利用ANSYS软件进行了计算机模拟热分析，分析了螺旋线采用镀铜膜，镀金膜，镀金刚石膜对慢波组件散热性能的影响。最后，对镀铜和镀金螺旋线的慢波组件进行了实验研究。实验结果与理论分析非常一致。Abstract: The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. ANSYS is used to simulate the thermal conduction in the components. The influence of helices coated with copper film, gold film, diamond film upon the heat dissipation is analyzed and verified with computer simulation. Finally, several experimental tests are performed in some slow-wave circuits with copper plated helix and gold plated helix. The tests show good agreement with the theoretical analysis.
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Rocci J. Thermal-structural reliability assessment of helixTWT interaction circuit using finite element analysis.Aerospace and Electronics Conference, New York, 1993:731-737.[2]Sauseng O, and Manoly A E, et al.. Thermal properties andpower capability of helix structures for millimeter waves.International Electron Devices Meeting, New York, 1978: 534-537.[3]Crivello R, et al.. Thermal analysis of PPM-focusedrod-supported TWT helix structures[J].IEEE Trans. onElectron Devices.1988, 35(10):1701-1720[4]Verma L S, Shrotriya S, and Chaudhary D. Thermalconduction in two-phase materials with spherical andnon-spherical inclusions[J].J. Physics D.1991, 24(5):1729-1737[5]Springer G S and Tsai S W. Thermal conductivities ofunidirectional materials[J].J. Comp. Materials.1967, 1(3):166-173[6]Kunkel S H and Peck W M. Predicting thermal contactresistance in circuit card assemblies. InterSociety Conferenceon Thermal Phenomena, Texas, 1994: 91-100. -
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