3D Contactless Chiplet Interconnects for CMOS Image Sensor

XU Zhihang; XU Yongye; MA Tongchuan; DU Li; DU Yuan

doi:10.11999/JEIT230382

Volume 45 Issue 9

Sep. 2023

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XU Zhihang, XU Yongye, MA Tongchuan, DU Li, DU Yuan. 3D Contactless Chiplet Interconnects for CMOS Image Sensor[J]. Journal of Electronics & Information Technology, 2023, 45(9): 3150-3156. doi: 10.11999/JEIT230382

Citation:

XU Zhihang, XU Yongye, MA Tongchuan, DU Li, DU Yuan. 3D Contactless Chiplet Interconnects for CMOS Image Sensor[J]. Journal of Electronics & Information Technology, 2023, 45(9): 3150-3156. doi: 10.11999/JEIT230382

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3D Contactless Chiplet Interconnects for CMOS Image Sensor

doi: 10.11999/JEIT230382

School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China

Funds: The National Key Research and Development Program of China (2021YFA0717700), The National Natural Science Foundation of China (62211530492, 62004096)

Received Date: 2023-05-06
Accepted Date: 2023-08-21
Rev Recd Date: 2023-08-19

Available Online: 2023-08-23

Publish Date: 2023-09-27

Abstract

Abstract

In the post-Moore era, 3D Chiplet clusters are typically integrated heterogeneously using Through Silicon Vias (TSVs), whose complex flow increases the difficulty and cost of chip manufacturing. Based on the upside-down packaging of BackSide-Illuminated (BSI) CMOS Image Sensors (CIS), a 3D Chiplet non-contact interconnection technique with low-cost and low packaging complexity is proposed. Using inductive coupling, a three-layer distributed transceiver structure of data source, carrier source, and receiver is constructed. Based on CSMC 0.25 μm CMOS process and DB-HiTek 0.11 μm CIS process, the feasibility of the proposed interconnects is verified by simulation and chip measurement. The test results show that the 3D Chiplet non-contact link can cover 5～20 μm communication distance with 20 GHz carrier frequency, achieving a BER of less than 10^-8 at the data rate of 200 Mbit/s. The power consumption of the receiver is 1.09 mW, and the energy efficiency of it is 5.45 pJ/bit.
- Chiplet,
- Inductive coupling,
- 3D integrated interconnects,
- CMOS Image Sensor (CIS)

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References(22)

References

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