Liu Yuling, Wang Guizhen, Xu Xiaohui, Li Xiangdu, Zhang Zhihua. CONTROLLING METALLIC IMPURITY AND MICRODEFECT IN SILICON CVD EPITAXY LAYER USING CONTRARY COMPENSATION[J]. Journal of Electronics & Information Technology, 1996, 18(1): 109-112.
Citation:
Liu Yuling, Wang Guizhen, Xu Xiaohui, Li Xiangdu, Zhang Zhihua. CONTROLLING METALLIC IMPURITY AND MICRODEFECT IN SILICON CVD EPITAXY LAYER USING CONTRARY COMPENSATION[J]. Journal of Electronics & Information Technology, 1996, 18(1): 109-112.
Liu Yuling, Wang Guizhen, Xu Xiaohui, Li Xiangdu, Zhang Zhihua. CONTROLLING METALLIC IMPURITY AND MICRODEFECT IN SILICON CVD EPITAXY LAYER USING CONTRARY COMPENSATION[J]. Journal of Electronics & Information Technology, 1996, 18(1): 109-112.
Citation:
Liu Yuling, Wang Guizhen, Xu Xiaohui, Li Xiangdu, Zhang Zhihua. CONTROLLING METALLIC IMPURITY AND MICRODEFECT IN SILICON CVD EPITAXY LAYER USING CONTRARY COMPENSATION[J]. Journal of Electronics & Information Technology, 1996, 18(1): 109-112.
This paper analyzes the mechanism models of metallic impurity infection and adsorption-desorption, and the distribution law of microdefect in growing of silicon CVD epitaxy, and then a new epitaxy technology is proposed, which is optimized by using contrary compensation, and by which the metallic impurity and microdefect in silicon epitaxy layer are reduced effectively.
黄汉尧,等.半导体器件工艺原理.上海:上海科技出版社,1985, 46-93.[2]刘玉玲,等实用发明创造工程学.石家庄:河北科学技术出版社,1993, 9, 269-274.[3]Srinvasan G R. Solid State Tech., 1981, 124(11): 101-104.[4]胡国仁,等.P/P+外延工艺技术的操作.第八届全国半导体集成电路硅材料学术会议论文集,杭州:1993,43.[5]Zhou Z H. J. Vac. Sci. Tech., 1991, B9(2): 374-376.[6]刘玉玲.半导体技术,1981, (1): 1-9.[7]Sator S, et al., Jpn J. Appl. Phys., 1981, 20(1): 143-145.