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Volume 16 Issue 3
May  1994
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Fu Xinghua, Huang Qingan, Chen Junning, Tong Qinyi. REQUIREMENT OF SILICON FLATNESS FOR SILICON DIRECT BONDING TECHNOLOGY[J]. Journal of Electronics & Information Technology, 1994, 16(3): 290-295.
Citation: Fu Xinghua, Huang Qingan, Chen Junning, Tong Qinyi. REQUIREMENT OF SILICON FLATNESS FOR SILICON DIRECT BONDING TECHNOLOGY[J]. Journal of Electronics & Information Technology, 1994, 16(3): 290-295.

REQUIREMENT OF SILICON FLATNESS FOR SILICON DIRECT BONDING TECHNOLOGY

  • Received Date: 1992-12-28
  • Rev Recd Date: 1993-04-12
  • Publish Date: 1994-05-19
  • The influence of silicon slice flatness on bonding technology and the relation between foreign particle and resulting bubble are quantitatively presented by the elastic theory. It is demonstrated experimentally by X ray double crystal dif-fractometry and infrared transmission imager.
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