Study of Routing Algorithm in Multichip Modules

Wong C P, Wong M M. Recent advances in plastic packaging of flip-chip and MultiChip Modules(MCM) of microelectronics[J].IEEE Trans. on Components and Packaging Technology.1999, 22(1):21-25[2]Khoo Kei-Yong, Cong Jason. An efficient multilayer MCM router based on four-via routing. 30th ACM/IEEE Design Automation Conference. Santa Cruz, California, 1993: 590-595.[3]Khoo Kei-Yong, Cong Jason. A fast multilayer general area router for MCM designs[J].IEEE Trans. on Circuits and Systems.1992, 39(1):841-859[4]Yu Qiong.[J].Standeep B, Sherwani N. CD3D：A constraint-driven 3-dimensional router for MCMS. MCM98, California.1998,:-[5]Cong Jason, Madden P H. Performance driven multi-layer general area routing for PCB/MCM designs. Electronic Components and Technology Conference, Stockholm, Sweden, 1999: 356-361.[6]畅艺峰，杨银堂，柴常春. MCM高速电路布局布线设计及信号传输特性仿真. 西安电子科技大学学报，2005，32(1)：44-47.[7]Dressel W, Mangold T. Time domain characterization of multichip module elements. IEEE Trans. on Microwave Theory and Techniques, 1998, 32(1): 1033-1036.[8]Pendurkar R Y. Design for testability techniques and optimization algorithms for performance and functional testing of multichip module interconnections. Abstracts International, 1999, Volume: 61-04, Section B: 2119.