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Volume 45 Issue 5
May  2023
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CAI Zhikuang, ZHOU Guopeng, SONG Jian, WANG Zixuan, GUO Yufeng. A Universal Test Access Port Controller Circuit Design for Chiplet Testing[J]. Journal of Electronics & Information Technology, 2023, 45(5): 1593-1601. doi: 10.11999/JEIT220854
Citation: CAI Zhikuang, ZHOU Guopeng, SONG Jian, WANG Zixuan, GUO Yufeng. A Universal Test Access Port Controller Circuit Design for Chiplet Testing[J]. Journal of Electronics & Information Technology, 2023, 45(5): 1593-1601. doi: 10.11999/JEIT220854

A Universal Test Access Port Controller Circuit Design for Chiplet Testing

doi: 10.11999/JEIT220854
Funds:  The National Natural Science Foundation of China (61974073)
  • Received Date: 2022-06-27
  • Rev Recd Date: 2022-07-26
  • Available Online: 2022-07-29
  • Publish Date: 2023-05-10
  • In the post-Moore era, Chiplet is the most hottest integration technique for heterogeneous integrated circuit, which is characterized by complex multi-core stacked structures. In order to solve the post-bonding test problem of Chiplet in different stacked structures, a Universal Test Access Port Controller (UTAPC) circuit is proposed based on IEEE 1838 standard protocol. Based on the traditional Test Access Port (TAP) controller, the Chiplet Dedicated Finite State Machine (CDFSM) is designed, also the Chiplet configuration registers and Chiplet test interface circuit are added. Under the influence of the configuration registers’ control signals generated by the CDFSM, the configuration signals outputted from the Chiplet configuration registers are used to control the Chiplet test interface circuit to set up the effective test path of Chiplet, which realized to access cores cross layers. The simulation results demonstrate that the proposed UTAPC circuit is suitable for the design for test of Chiplet with arbitrary stacked structures. It can not only choose to test cores flexibly, but also save the resources of test ports and test time, as well as improve the test efficiency.
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  • [1]
    LOH G H, NAFFZIGER S, and LEPAK K. Understanding Chiplets today to anticipate future integration opportunities and limits[C]. Design, Automation & Test in Europe Conference & Exhibition (DATE), Grenoble, France, 2021: 142–145.
    [2]
    HANCOCK T M and DEMMIN J C. Heterogeneous and 3D integration at DARPA[C]. 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, 2019: 1–4.
    [3]
    余乐, 杨海钢, 谢元禄, 等. 三维集成电路中硅通孔缺陷建模及自测试/修复方法研究[J]. 电子与信息学报, 2012, 34(9): 2247–2253. doi: 10.3724/SP.J.1146.2012.00048

    YU Le, YANG Haigang, XIE Yuanlu, et al. A 3D IC self-test and recovery method based on through silicon via defect modeling[J]. Journal of Electronics &Information Technology, 2012, 34(9): 2247–2253. doi: 10.3724/SP.J.1146.2012.00048
    [4]
    HUTNER M, SETHURAM R, VINNAKOTA B, et al. Special session: Test challenges in a Chiplet marketplace[C]. 2020 IEEE 38th VLSI Test Symposium (VTS), San Diego, USA, 2020: 1–12.
    [5]
    HERRAULT F, WONG J, RAMOS I, et al. Chiplets in Wafers (CiW) - Process design kit and demonstration of high-frequency circuits with GaN Chiplets in silicon interposers[C]. IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, USA, 2021: 178–184.
    [6]
    常郝, 梁华国, 蒋翠云, 等. 一种3D堆叠集成电路中间绑定测试时间优化方案[J]. 电子学报, 2015, 43(2): 393–398. doi: 10.3969/j.issn.0372-2112.2015.02.029

    CHANG Hao, LIANG Huaguo, JIANG Cuiyun, et al. Optimization scheme for mid-bond test time on 3D-stacked ICs[J]. Acta Electronica Sinica, 2015, 43(2): 393–398. doi: 10.3969/j.issn.0372-2112.2015.02.029
    [7]
    KABIR M A, HUNG W, HO T Y, et al. Holistic and in-context design flow for 2.5D Chiplet-package interaction co-optimization[C]. 2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), Hsinchu, China, 2021: 1–4.
    [8]
    FKIH Y, VIVET P, ROUZEYRE B, et al. A JTAG based 3D DfT architecture using automatic die detection[C]. Proceedings of the 2013 9th Conference on Ph. D. Research in Microelectronics and Electronics (PRIME), Villach, Austria, 2013: 341–344.
    [9]
    DURUPT J, VIVET P, and SCHLOEFFEL J. IJTAG supported 3D DFT using chiplet-footprints for testing multi-chips active interposer system[C]. 2016 21th IEEE European Test Symposium (ETS), Amsterdam, Netherlands, 2016: 1–6.
    [10]
    MARINISSEN E J, DE WACHTER B, O'LOUGHLIN S, et al. Vesuvius-3D: A 3D-DfT demonstrator[C]. 2014 International Test Conference (ITC), Seattle, USA, 2014: 1–10.
    [11]
    IEEE Computer Society. IEEE 1838-2019 IEEE standard for test access architecture for three-dimensional stacked integrated circuits[S]. New York: IEEE, 2020.
    [12]
    JAN MARINISSEN E, MCLAURIN T, and JIAO Hailong. IEEE Std P1838: DfT standard-under-development for 2.5D-, 3D-, and 5.5D-SICs[C]. 2016 21th IEEE European Test Symposium (ETS), Amsterdam, Netherlands, 2016: 1–10.
    [13]
    VIVET P, GUTHMULLER E, THONNART Y, et al. IntAct: A 96-core processor with six chiplets 3D-stacked on an active interposer with distributed interconnects and integrated power management[J]. IEEE Journal of Solid-State Circuits, 2021, 56(1): 79–97. doi: 10.1109/JSSC.2020.3036341
    [14]
    陈圣俭, 李广进, 高华. 基于外壳架构与测试访问机制的数字芯核可测试性设计[J]. 微电子学与计算机, 2012, 29(6): 42–45,50. doi: 10.19304/j.cnki.issn1000-7180.2012.06.010

    CHEN Shengjian, LI Guangjing, and GAO Hua. Design for testability of digital cores based on wrapper and TAM[J]. Microelectronics &Computer, 2012, 29(6): 42–45,50. doi: 10.19304/j.cnki.issn1000-7180.2012.06.010
    [15]
    IEEE Computer Society. IEEE 1149.1-2013 IEEE standard for test access port and boundary-scan architecture[S]. New York: IEEE, 2013.
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