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Volume 10 Issue 3
May  1988
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Liu Enke, Jia Quanxi. A STUDY OF SIMULTANEOUS FORMATION OF AR AND BST FOR HIGH EFFICIENCY SILICON SOLAR CELLS[J]. Journal of Electronics & Information Technology, 1988, 10(3): 285-288.
Citation: Liu Enke, Jia Quanxi. A STUDY OF SIMULTANEOUS FORMATION OF AR AND BST FOR HIGH EFFICIENCY SILICON SOLAR CELLS[J]. Journal of Electronics & Information Technology, 1988, 10(3): 285-288.

A STUDY OF SIMULTANEOUS FORMATION OF AR AND BST FOR HIGH EFFICIENCY SILICON SOLAR CELLS

  • Received Date: 1986-07-21
  • Rev Recd Date: 1988-01-09
  • Publish Date: 1988-05-19
  • A new processing method in which the antireflective coating (AR) Si3N4 is deposite by LPCVD, at the same time, the Al-alloyed high low junction BSF is formed, is described. In the method, the procedure is simplified for fabricating high efficiency silicon solar cells, that is the AR-BSF to be formed in one step, and because the system is in high vacuum and the cells are in the ambinet of N2 as well as H2, so that the surface characteristics of emitters in the cells is improved.
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  • C. E. Norman, R. E. Tomas, IEEE Trans. on ED, ED-27(1980), 731-737.[2]A. Silard, R. Marinescu, M. Tazlauanu, IEEE Electron Device Letter, 4(1983), 164-166.[3]M. A. Green, et al.,IEEE Trans. on ED, ED-31(1981), 679-683.[4]A. Rohatgi, P. Rai-choudhary, IEEE Trans. on ED, ED-31(1984), 596-601.[5]J. Mandelkorn, J. H. Lamneck, Jr., Proc. 9th IEEE Photovoltaic Specialists Conf., Silver Spring, Maryland, 1972, ppp. 66-71.[6]M. B. Spitzer, S .P. Tobin, C. J. Keavney, IEEE Trans. on ED, ED-31(1984), 546-550.[7]R. Hezel, Solid State Electron., 24(1981), 863-868.[8]K. Rajkanan, J. Shewchun, Solid State Electron., 22(1979), 193-197.[9]J. C. Fossum, IEEE Trans. on ED, ED-24(1977), 323-325.[10]J. G. Fossum, E. L. Burgess, Appl. Phys. Lett, 33(1978), 238-240.[11]Jia Quanxi, Zhu Changchun, Liu Enke, Proc. 2nd Internatinonal Photovoltaic Science and engineering Conf.,Beijing, China, 1986, pp. 223-226.Jia Quanxi, Zhu Changchun, Liu Enke, Proc. 2nd International Photovoltaic Science and Engineering Conf, Beijing, China, 1986, pp. 328-331.
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