Shi Xiangqing, Yang Caibing, Qi Yizhi, Cao Xiaoneng, Ma Jindi, Huang Jizhang. FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE[J]. Journal of Electronics & Information Technology, 1987, 9(5): 473-476.
Citation:
Shi Xiangqing, Yang Caibing, Qi Yizhi, Cao Xiaoneng, Ma Jindi, Huang Jizhang. FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE[J]. Journal of Electronics & Information Technology, 1987, 9(5): 473-476.
Shi Xiangqing, Yang Caibing, Qi Yizhi, Cao Xiaoneng, Ma Jindi, Huang Jizhang. FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE[J]. Journal of Electronics & Information Technology, 1987, 9(5): 473-476.
Citation:
Shi Xiangqing, Yang Caibing, Qi Yizhi, Cao Xiaoneng, Ma Jindi, Huang Jizhang. FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE[J]. Journal of Electronics & Information Technology, 1987, 9(5): 473-476.
A pile-up masking technique using the conventional optical lithography and a two-step or three-step evaporation process is developed to fabricate the variable thickness superconducting microbridges of submicron. The l-V characterise of the microbridges made by the technique is measured at 4.2 k.
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