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Volume 31 Issue 12
Dec.  2010
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Han Yong, Liu Yan-wen, Ding Yao-gen, Liu Pu-kun. Synthetic Analysis Method of the Heat Dissipation Capability of Slow-Wave Structure for Helix TWT[J]. Journal of Electronics & Information Technology, 2009, 31(12): 3015-3018. doi: 10.3724/SP.J.1146.2008.01506
Citation: Han Yong, Liu Yan-wen, Ding Yao-gen, Liu Pu-kun. Synthetic Analysis Method of the Heat Dissipation Capability of Slow-Wave Structure for Helix TWT[J]. Journal of Electronics & Information Technology, 2009, 31(12): 3015-3018. doi: 10.3724/SP.J.1146.2008.01506

Synthetic Analysis Method of the Heat Dissipation Capability of Slow-Wave Structure for Helix TWT

doi: 10.3724/SP.J.1146.2008.01506
  • Received Date: 2008-11-14
  • Rev Recd Date: 2009-09-18
  • Publish Date: 2009-12-19
  • A novel, effective and synthetic analysis method is developed for studying the heat dissipation capability of slow-wave structure. This method, based on some theoretical and experimental research, is applicable to analyze the thermal conduction precisely and truly. This method can reduce the material costs and save the involved time. The consistency and the feasibility of this method are verified by some experimental tests on the slow-wave structures with BeO support rods, BN support rods and copper-plated helix.
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  • 韩勇, 刘燕文, 丁耀根等. 夹持杆的结构和尺寸对慢波结构散热特性影响的研究 [J].电子与信息学报.2008, 30(5):1267-1270浏览[2]Rocci P J. Thermal-structural reliability assessment of helixTWT interaction circuit using finite element analysis [C].Aerospace and Electronics Conference, London, 1993(5):731-737.[3]Ghosh T K, Challis A J, and Jacob A, et al.. Improvements inperformance of broadband helix Traveling-Wave Tubes [J].IEEE Transactions on Electronic Devices.2008, 55(8):668-673[4]Sauseng O and Manoly A E. Thermal properties and powercapability of helix structures for millimeter waves [C].International Electronic Device Meeting, New York, 1978:534-537.[5]Harper R and Puri M P. Heat transfer and power capabilityof EHF helix TWTs [C]. International Electronic DeviceMeeting, Washington, 1986: 498-500.[6]Vemula Bhanu Naidu, Subrata Kumar Datta, and RajaRamana Rao, et al.. Analysis of sever-loss in a helicalslow-wave structure [C]. IEEE International VacuumElectronics Conference, London, 2008: 304-305.[7]Goren Y, Schram A, and Gagne D, et al.. Accuratemeasurements of the dielectric properties of TWT BeOsupport rods [C]. IEEE International Vacuum ElectronicsConference, New York, 2007: 141-142.[8]Crivello R. Thermal analysis of PPM-focused rod-supportedTWT helix structures [J]. IEEE Transactions on ElectronicDevices, 1988, 35(10): 1701-1720.[9]Kunkel S H and Peck W M. Predicting thermal contactresistance in circuit card assemblies [C]. InterSocietyConference on Thermal Phenomena, Texas, 1994: 91-100.[10]Han Yong, Liu Yan-wen, and Ding Yao-gen, et al.. Anevaluation of heat dissipation capability of the slow-wavestructures [J].IEEE Transactions on Electronic Devices.2007,54(8):1562-1565
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