Research on the Thermal Analysis of PCB Circuit

Sun Jian; Ding Yao-gen; Chen Zhong-lin

doi:10.3724/SP.J.1146.2007.01904

Volume 31 Issue 4

Dec. 2010

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Article Navigation > Journal of Electronics & Information Technology > 2009 > 31(4): 1013-1016

Sun Jian, Ding Yao-gen, Chen Zhong-lin. Research on the Thermal Analysis of PCB Circuit[J]. Journal of Electronics & Information Technology, 2009, 31(4): 1013-1016. doi: 10.3724/SP.J.1146.2007.01904

Citation:

Sun Jian, Ding Yao-gen, Chen Zhong-lin. Research on the Thermal Analysis of PCB Circuit[J]. Journal of Electronics & Information Technology, 2009, 31(4): 1013-1016. doi: 10.3724/SP.J.1146.2007.01904

Sun Jian, Ding Yao-gen, Chen Zhong-lin. Research on the Thermal Analysis of PCB Circuit[J]. Journal of Electronics & Information Technology, 2009, 31(4): 1013-1016. doi: 10.3724/SP.J.1146.2007.01904

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Research on the Thermal Analysis of PCB Circuit

doi: 10.3724/SP.J.1146.2007.01904

Received Date: 2007-12-12
Rev Recd Date: 2008-04-22
Publish Date: 2009-04-19

Abstract

Abstract

In this article, the ANSYS modeling problem of PCB thermal reliability analysis is studied. By ANSYS analysis, two conclusions can be drawn: (1) Copper lead on PCB has significant thermal transmission effect, so it should not be omitted in modeling. (2) Component with little inner to exterior thermal resistance can be modeling as a simple block. Based on these conclusions, the ANSYS modeling of a satelliteborne PCB equipment is largely simplified. Compared the ANSYS calculation results with experiment datas, it is proved that the simplified modeling method achieves adequate precision and is very convenience to use. This technique can be adopted in the thermal reliability analysis of PCB equipments , especially for satelliteborne or vacuum environments.

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References

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