国防科工委军用标准化中心. 电子设备可靠性热设计手册实施指南[M]. 北京, 国防工业出版社, 1992.[2]丁耀根. 大功率微波电真空器件的发展动向[J]. 真空电子技术, 2006, 3: 37-40.Ding Yao-gen. The trend of high power microwave vacuumdevices [J]. Vacuum Electronics, 2006, 3: 37-40.[3]Barker R J, Booske J H, and Luhmann Jr N C, et al.. ModernMicrowave and Millimeter-wave Power Electronics [M]. IEEEPress, New York, 2005: Ch.4.[4]Harper R and Puri M P. Heat transfer and power capabilitiesof EHF helix TWTs [C]. International Electron DevicesMeeting, Washington, DC, 1986: 498-500.[5]Han Yong, Liu YanWen, and Ding YaoGen, et al.. Anevaluation of heat dissipation capability of slow wavestructures [J].IEEE Trans. on Electron Devices.2007, 54(6):1562-1565[6]Lie Ming Yao, Zhong Hai Yang, and Bin Li, et al.. Thermalanalysis of novel helix TWTs [C]. IEEE InternationalVacuum Electronics Conference, Monterey, California, 2006:139-140.[7]赵兴群, 张国兴, 孙小菡等. 脉冲螺线行波管热状态分析及ANSYS 模拟[J]. 电子学报, 2004, 32(6): 1029-1032.Zhao Xing-qun, Zhang Guo-xing, and Sun Xiao-han, et al..The analysis and ANSYS simulation for the thermalcondition of pulse helix TWT [J]. Acta Electronica Sinica,2004, 32(6): 1029-1032.
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