Advanced Search
Volume 30 Issue 7
Jan.  2011
Turn off MathJax
Article Contents
Zhang Mu-shui, Li Yu-shan, Li Li-ping, Jia Chen . The MMTL Model for High-Speed Connectors Based on TDR Measurement[J]. Journal of Electronics & Information Technology, 2008, 30(7): 1760-1762. doi: 10.3724/SP.J.1146.2007.00347
Citation: Zhang Mu-shui, Li Yu-shan, Li Li-ping, Jia Chen . The MMTL Model for High-Speed Connectors Based on TDR Measurement[J]. Journal of Electronics & Information Technology, 2008, 30(7): 1760-1762. doi: 10.3724/SP.J.1146.2007.00347

The MMTL Model for High-Speed Connectors Based on TDR Measurement

doi: 10.3724/SP.J.1146.2007.00347
  • Received Date: 2007-03-12
  • Rev Recd Date: 2007-10-16
  • Publish Date: 2008-07-19
  • In this paper, a new SPICE model Multi-segment Multiple Transmission Line model (MMTL) is developed to model high-speed connectors based on Time Domain Reflection (TDR) measurements. This model is superior to MLC model in aspects of stabilization and efficiency. It is easy to be understood and optimized. Its accuracy can be under controlled. The excellent performance of the MMTL model is verified with experiments.
  • loading
  • Dambach J, Ahmad M, Cashier P, and Regnier K.Development of a 10Gb I/O connector system, DesignCon2005 [C], Santa Clara, California, 2005: 31/1-3/2.Resso M, Minger R, Roe J, and Gneiting T. Investigatingmicrovia technology for 10Gbps and higher telecommunicationsystem, DesignCon2005 [C], Santa Clara, California, 2005:31/1-3/2.[2]Jong J M, Janko B, and Tripathi V. Equivalent circuitmodeling of interconnects from time-domainmeasurements[J].IEEE Trans. on Components, Hybrids, andManufacturing Technology.1993, 16(1):119-126[3]McGibney E and Barrett J. An overview of electricalcharacterization techniques and theory for IC packages andinterconnects [J]. IEEE Trans. on Advanced Packaging, 2006,19(1): 131-139.[4]Deutsch A, Surovic C W, Campbell J C, Coteus P W,Lanzetta A P, Holton J T, and Knight A D. Electricalcharacteristics of high-performance pin-in-socket andpad-on-pad connectors[J]. IEEE Trans. on AdvancedPackaging., 1997, 20(1): 64-77.[5]Kao C H, Tseng C C, Ming F, and Lai M F. A BetterTechnique using multisegment modeling and analysis ofhigh-density and high-speed connector [J].IEEE Trans. onAdvanced Packaging.2006, 29(1):140-148[6]Tripathi A and Tripathi V K. A configuration-orientedSPICE model for multiconductor transmission lines in aninhomogeneous medium[J].IEEE Trans. on MicrowaveTheory and Techniques.1998, 46(12):1997-2005
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Article Metrics

    Article views (3255) PDF downloads(841) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return