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Volume 30 Issue 8
Jan.  2011
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Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137
Citation: Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137

Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit

doi: 10.3724/SP.J.1146.2007.00137
  • Received Date: 2007-01-23
  • Rev Recd Date: 2007-06-25
  • Publish Date: 2008-08-19
  • The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. ANSYS is used to simulate the thermal conduction in the components. The influence of helices coated with copper film, gold film, diamond film upon the heat dissipation is analyzed and verified with computer simulation. Finally, several experimental tests are performed in some slow-wave circuits with copper plated helix and gold plated helix. The tests show good agreement with the theoretical analysis.
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  • Rocci J. Thermal-structural reliability assessment of helixTWT interaction circuit using finite element analysis.Aerospace and Electronics Conference, New York, 1993:731-737.[2]Sauseng O, and Manoly A E, et al.. Thermal properties andpower capability of helix structures for millimeter waves.International Electron Devices Meeting, New York, 1978: 534-537.[3]Crivello R, et al.. Thermal analysis of PPM-focusedrod-supported TWT helix structures[J].IEEE Trans. onElectron Devices.1988, 35(10):1701-1720[4]Verma L S, Shrotriya S, and Chaudhary D. Thermalconduction in two-phase materials with spherical andnon-spherical inclusions[J].J. Physics D.1991, 24(5):1729-1737[5]Springer G S and Tsai S W. Thermal conductivities ofunidirectional materials[J].J. Comp. Materials.1967, 1(3):166-173[6]Kunkel S H and Peck W M. Predicting thermal contactresistance in circuit card assemblies. InterSociety Conferenceon Thermal Phenomena, Texas, 1994: 91-100.
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