Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137
Citation:
Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137
Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137
Citation:
Han Yong, Liu Yan-Wen, Ding Yao-Gen, Liu Pu-Kun, Lu Chun-Hua, Wang Xiao-Yan. Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit[J]. Journal of Electronics & Information Technology, 2008, 30(8): 2029-2032. doi: 10.3724/SP.J.1146.2007.00137
The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. ANSYS is used to simulate the thermal conduction in the components. The influence of helices coated with copper film, gold film, diamond film upon the heat dissipation is analyzed and verified with computer simulation. Finally, several experimental tests are performed in some slow-wave circuits with copper plated helix and gold plated helix. The tests show good agreement with the theoretical analysis.
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