Three-dimensional Electric Field Sensing Chip Via Piezoelectric Actuation in a Single Shielding Electrode

PENG Simin; XIA Shanhong; LIU Xiangming; GAO Yahao; ZHANG Zhouwei; ZHANG Wei; XING Xuebin; LIU Yufei; WU Zhengwei; PENG Chunrong

doi:10.11999/JEIT230361

Volume 46 Issue 4

Apr. 2024

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Article Navigation > Journal of Electronics & Information Technology > 2024 > 46(4): 1513-1520

PENG Simin, XIA Shanhong, LIU Xiangming, GAO Yahao, ZHANG Zhouwei, ZHANG Wei, XING Xuebin, LIU Yufei, WU Zhengwei, PENG Chunrong. Three-dimensional Electric Field Sensing Chip Via Piezoelectric Actuation in a Single Shielding Electrode[J]. Journal of Electronics & Information Technology, 2024, 46(4): 1513-1520. doi: 10.11999/JEIT230361

Citation:

PENG Simin, XIA Shanhong, LIU Xiangming, GAO Yahao, ZHANG Zhouwei, ZHANG Wei, XING Xuebin, LIU Yufei, WU Zhengwei, PENG Chunrong. Three-dimensional Electric Field Sensing Chip Via Piezoelectric Actuation in a Single Shielding Electrode[J]. Journal of Electronics & Information Technology, 2024, 46(4): 1513-1520. doi: 10.11999/JEIT230361

Citation:

PENG Simin, XIA Shanhong, LIU Xiangming, GAO Yahao, ZHANG Zhouwei, ZHANG Wei, XING Xuebin, LIU Yufei, WU Zhengwei, PENG Chunrong. Three-dimensional Electric Field Sensing Chip Via Piezoelectric Actuation in a Single Shielding Electrode[J]. Journal of Electronics & Information Technology, 2024, 46(4): 1513-1520. doi: 10.11999/JEIT230361

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Three-dimensional Electric Field Sensing Chip Via Piezoelectric Actuation in a Single Shielding Electrode

doi: 10.11999/JEIT230361

PENG Simin^{1, 2},
XIA Shanhong^{1
,
,},
LIU Xiangming^{1, 2},
GAO Yahao^{1, 2},
ZHANG Zhouwei^{1, 2},
ZHANG Wei^{1, 2},
XING Xuebin^{1, 2},
LIU Yufei^{1, 2},
WU Zhengwei¹,
PENG Chunrong¹

1.
State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Science, Beijing 100190, China
2.
School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

Funds: The National Natural Science Foundation of China (62031025, 61971398), The National Key R＆D Program of China (2022YFB3207300, 2021YFB2011700), The Scientific Instrument Developing Project of the Chinese Academy of Sciences (YJKYYQ20200026, GJJSTD20210004)

Received Date: 2023-05-04
Rev Recd Date: 2023-06-30

Available Online: 2023-07-06

Publish Date: 2024-04-24

Abstract

Abstract

A three-dimensional electric field sensing chip equipped with a single shielding electrode and piezoelectric actuation is proposed. This design achieves high-sensitivity detection of the three-dimensional electric fields, simultaneously reducing excitation voltage and crosstalk noise is proposed. The sensing structure comprises one group of shielding electrodes and four sets of symmetrically distributed sensing electrodes. In response to piezoelectric actuation, the shielding electrodes undergo vertical vibrations, while the four sensing electrode sets generate induced currents when subjected to external electric fields. A differential decoupling method can be used to calculate the signals corresponding to the electric field components along the x-, y-, and z-axes. Finite element simulation was conducted to design the structure of the three-dimensional electric field sensing chip, analyze the feasibility of its measurement, and optimize key structural parameters. The fabrication process for the sensing chip was designed and implemented. Experimental results reveal that the output sensitivities are 0.2214 mV/(kV/m) for the x-axis, 0.3580 mV/(kV/m) for the y-axis, and 2.1768 mV/(kV/m) for the z-axis. The maximum measurement error for the three-dimensional electric fields remains < 5.3%.
- Single shielding electrode,
- Three-dimensional,
- Electric field,
- Vertical vibration

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References(25)

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