Evaporation Characteristics of Oxygen Free Copper for Microwave Vacuum Electron Devices

Fen LI; Guojian WANG; Hong TIAN; Yongliang LIU; Yanchun YU; Wei LÜ; Yanwen LIU

doi:10.11999/JEIT200846

Volume 43 Issue 9

Sep. 2021

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Article Navigation > Journal of Electronics & Information Technology > 2021 > 43(9): 2751-2756

Fen LI, Guojian WANG, Hong TIAN, Yongliang LIU, Yanchun YU, Wei LÜ, Yanwen LIU. Evaporation Characteristics of Oxygen Free Copper for Microwave Vacuum Electron Devices[J]. Journal of Electronics & Information Technology, 2021, 43(9): 2751-2756. doi: 10.11999/JEIT200846

Citation:

Fen LI, Guojian WANG, Hong TIAN, Yongliang LIU, Yanchun YU, Wei LÜ, Yanwen LIU. Evaporation Characteristics of Oxygen Free Copper for Microwave Vacuum Electron Devices[J]. Journal of Electronics & Information Technology, 2021, 43(9): 2751-2756. doi: 10.11999/JEIT200846

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Evaporation Characteristics of Oxygen Free Copper for Microwave Vacuum Electron Devices

doi: 10.11999/JEIT200846 cstr: 32379.14.JEIT200846

1.
Aerospace Information Research Institute, Chinese Academy of science, Beijing 100190, China
2.
University of Chinese Academy of Sciences, Beijing 100049, China

Funds: The National Natural Science Foundation of China(61771454)

Received Date: 2020-09-30
Rev Recd Date: 2021-03-24

Available Online: 2021-04-15

Publish Date: 2021-09-16

Abstract

Abstract

As one of the commonly used materials for microwave vacuum electronic devices, the evaporation characteristics of oxygen free copper materials will affect the electrical properties of microwave vacuum electronic devices. In this paper, the effect of treatment process on the evaporation performance of oxygen free copper is studied by using ultra-high vacuum testing equipment. The thickness of evaporated copper film is measured by X-ray thickness gauge. And the surface morphology of oxygen free copper is observed by Scanning Electron Microscope (SEM). The results show that the macro-appearance surface roughness has little effect on the evaporation performance of oxygen free copper materials, but the treatment process has a great influence on the evaporation performance. The evaporation capacity of oxygen free copper will be increased after acid pickling and the evaporation capacity of oxygen free copper materials can be reduced by calcination in hydrogen. The evaporation capacity of oxygen free copper treated by deoiling cleaning and calcination in hydrogen is very low. The surface of oxygen free copper is analyzed. It is found that the vacuum evaporation performance of oxygen free copper material is related to the surface morphology of the material. The microscopic surface is smooth without oxidation and holes, and the vacuum evaporation of oxygen free copper material is less.
- Microwave vacuum electron devices,
- Oxygen free copper,
- Evaporation,
- Acid pickling,
- Calcination in hydrogen

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References(19)

References

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