Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails

Jianjian SUN; Jianhua XU; Haifeng CHENG; Qinglin ZHU; Xu HAN

doi:10.11999/JEIT190791

Volume 42 Issue 12

Dec. 2020

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Article Navigation > Journal of Electronics & Information Technology > 2020 > 42(12): 3074-3080

Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791

Citation:

Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791

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Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails

doi: 10.11999/JEIT190791

Nanjing Electronic Devices Institute, Nanjing 210016, China

Received Date: 2019-10-16
Rev Recd Date: 2020-05-24

Available Online: 2020-07-14

Publish Date: 2020-12-08

Abstract

Abstract

In order to dampen the parallel plate modes and cavity modes within the frequency range of interest, and improve the stability of power amplifiers, a Ka-band solid-state power amplifier module, which is packaged with an Artificial Magnetic Conductors (AMC) boundary is presented in this paper. The AMC boundary is realized with Electromagnetic Band Gap (EBG) which is constructed by a period of metal nails in this paper. A Ka-band solid-state power amplifier module is designed, fabricated, assembled and measured. Performances of the packages are evaluated and discussed in detail on the basis of a series of S-parameter simulations and measurements. By compare with other packaging conditions, an improved module isolation and a suppressed cavity resonance are observed from passive measured results. Active measured results indicate that the package does not interfere with output power of the amplifier.
- Artificial Magnetic Conductor(AMC),
- Electromagnetic Band Gap(EBG),
- Package,
- Resonance,
- Power amplifier

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References(21)

References

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