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Volume 40 Issue 8
Aug.  2018
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Biyun LING, Chunrong PENG, Ren REN, Zhaozhi CHU, Zhouwei ZHANG, Hucheng LEI, Shanhong XIA. MEMS-based Three-dimensional Electric Field Sensor with Low Cross-axis Coupling Interference[J]. Journal of Electronics & Information Technology, 2018, 40(8): 1934-1940. doi: 10.11999/JEIT171188
Citation: Biyun LING, Chunrong PENG, Ren REN, Zhaozhi CHU, Zhouwei ZHANG, Hucheng LEI, Shanhong XIA. MEMS-based Three-dimensional Electric Field Sensor with Low Cross-axis Coupling Interference[J]. Journal of Electronics & Information Technology, 2018, 40(8): 1934-1940. doi: 10.11999/JEIT171188

MEMS-based Three-dimensional Electric Field Sensor with Low Cross-axis Coupling Interference

doi: 10.11999/JEIT171188
Funds:  The National Natural Science Foundation of China (61327810), The National 863 Program of China (2015AA042602), Chinese Academy of Sciences Project (CXJJ-17-M151)
  • Received Date: 2017-12-18
  • Rev Recd Date: 2018-05-07
  • Available Online: 2018-06-12
  • Publish Date: 2018-08-01
  • Cross-axis coupling interference influences greatly the measurement accuracy of Three-Dimensional (3D) Electric Field Sensor (EFS). A MEMS-based One-Dimensional (1D) Electric Field Microsensor (EFM) chip with low coupling interference is presented, and a MEMS-based 3D EFS with low cross-axis coupling interference is developed by arranging three 1D EFM chips orthogonally. Different from previously reported 1D EFM chips sensitive to perpendicular electric field component, the proposed 1D EFM chip is designed to be symmetrical and connected to difference circuit, so that it is capable of sensing parallel electric field component perpendicular to axis of symmetry and eliminating coupling interference. The proposed 3D EFS has the advantages of small size and high integration. Experimental results reveal that in the range of 0~120 kV/m, the cross-axis sensitivities are within 3.48%, and the total measurement errors of this 3D EFS are within 7.13%.
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