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Volume 38 Issue 11
Dec.  2016
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WEN Xiaolong, REN Tianling, XIA Shanhong. Electrode Package for Electric Field Micro Sensor[J]. Journal of Electronics & Information Technology, 2016, 38(11): 2960-2964. doi: 10.11999/JEIT160608
Citation: WEN Xiaolong, REN Tianling, XIA Shanhong. Electrode Package for Electric Field Micro Sensor[J]. Journal of Electronics & Information Technology, 2016, 38(11): 2960-2964. doi: 10.11999/JEIT160608

Electrode Package for Electric Field Micro Sensor

doi: 10.11999/JEIT160608
Funds:

The National Natural Science Foundation of China (61302032, 61327810, 61201078)

  • Received Date: 2016-06-08
  • Rev Recd Date: 2016-09-14
  • Publish Date: 2016-11-19
  • To improve the environmental adaptation of the package of electric field micro sensor, this article introducs a new electrode package. Different from placing the sensing chip and package inside the measured environment, a package electrode, which is the only part exposed outside, is invented. In this way, the package shell is effectively protected from various environmental extremes. Based on this structure, new atmospheric electric field micro sensors are introduced on the ground and for sounding. The FEM and experiments show that the new sensors measure electric field accurately and stably under high humidity and low temperature environment.
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