Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor

doi:10.11999/JEIT150105

Volume 37 Issue 9

Sep. 2015

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Article Navigation > Journal of Electronics & Information Technology > 2015 > 37(9): 2282-2286

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105

Citation:

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105

Citation:

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105

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Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor

doi: 10.11999/JEIT150105

Received Date: 2015-01-20
Rev Recd Date: 2015-04-14
Publish Date: 2015-09-19

Abstract

Abstract

In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.
- Micro-Electro-Mechanical Systems (MEMS),
- Electric field micro-sensor,
- Chip-level,
- Vacuum package

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References(22)

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