Research on Ka-band Enhanced Active Load Modulation Ultra-wideband High-efficiency Doherty Power Amplifier
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摘要: Ka波段是未来新一代高通量卫星的核心频段,卫星通信发射系统对功率放大器提出了高回退效率的严苛要求。Doherty功率放大器(DPA)通过有源负载调制显著提高了功率回退状态下的工作效率,但Doherty架构的固有阻抗变换网络严重限制了其工作带宽,同时,其在毫米波段的饱和与回退效率均大幅下降,这成为制约其在毫米波高通量卫星通信系统中应用的关键瓶颈。针对上述问题,该文提出一种超宽带增强型有源负载调制技术,有效突破Doherty功率放大器带宽和回退效率相互制约的瓶颈,实现毫米波Doherty架构的效率增强和带宽扩展。同时,创新地提出了一种超宽带相位补偿非等分功率分配网络,扩展了高效率带宽,同时缩小了芯片面积。为验证所提理论,基于0.15 μm GaN工艺,设计了一款毫米波超宽带高效率Doherty功率放大器芯片,最终在24~33 GHz(相对带宽达到31.6%)的超宽频带内,实现了21.8~23.8 dB的小信号增益,28.9~31.0 dBm的饱和输出功率,饱和功率附加效率(PAE)为25.2%~33.5%,6 dB回退PAE为15.5%~19.8%。在目前所报道的相近频带的毫米波GaN Doherty功放中,具有最高的小信号增益及饱和PAE,高的饱和输出功率和6 dB回退PAE等一系列优异性能,同时在目前所报道的2~3级DPA芯片中具有最小的芯片面积。
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关键词:
- 卫星通信 /
- 毫米波 /
- Doherty功率放大器 /
- 超宽带 /
- 高效率
Abstract:Objective The Ka-band has become a key frequency band for satellite communications, placing stringent requirements on the millimeter-wave power amplifier, a core component of the transmitter, to provide high efficiency, compact size, and broadband operation. To maximize spectral efficiency, millimeter-wave satellite communication signals typically exhibit a high Peak-to-Average Power Ratio (PAPR), making high back-off efficiency particularly important. Although the Doherty Power Amplifier (DPA) is widely adopted because of its high efficiency under power back-off conditions, its operating bandwidth is inherently limited. In addition, both saturated efficiency and back-off efficiency degrade substantially at millimeter-wave frequencies. Therefore, extending the operating bandwidth while maintaining high efficiency remains a major challenge for millimeter-wave DPAs used in satellite communication transmitters. Methods An ultra-wideband enhanced active load modulation technique is proposed to overcome the trade-off between bandwidth and back-off efficiency in DPAs. The proposed method achieves optimal load impedance modulation for both the carrier and peaking amplifiers over an ultra-wide frequency range by introducing an Impedance Tunable Bias Network (ITBN) and a dual-drive impedance control mechanism. These techniques improve load modulation while extending the load modulation bandwidth, thereby enhancing both efficiency and bandwidth in the millimeter-wave DPA architecture. Furthermore, a broadband phase-compensation technique is integrated into an unequal power division network to achieve sufficient load modulation across the entire operating band while accurately compensating for the phase difference between the carrier and peaking paths. The proposed ultra-wideband phase-compensated power division network further extends the high-efficiency operating bandwidth while reducing the chip area. Results and Discussions To validate the proposed method, a millimeter-wave ultra-wideband high-efficiency DPA was designed and fabricated using a 0.15-μm GaN process. Across the 24~33 GHz frequency band, corresponding to a relative bandwidth of 31.6%, the fabricated chip achieves a small-signal gain of 21.8~23.8 dB with a gain flatness of ±1 dB. The measured saturated output power is 28.9~31.0 dBm, with a Power-Added Efficiency (PAE) of 25.2%~33.5% at saturation and a 6 dB back-off PAE of 15.5%~19.8%. Compared with previously reported GaN DPAs operating over similar frequency bands, the proposed design achieves the highest reported small-signal gain and saturated PAE while maintaining high saturated output power and high 6 dB back-off PAE. Furthermore, it occupies the smallest chip area among reported three-stage DPA MMICs. Conclusions An ultra-wideband enhanced active load modulation method is proposed to achieve sufficient active load modulation through multi-frequency impedance tuning across the entire operating band. A novel ultra-wideband phase-compensated unequal power division network is also proposed to reduce the chip area while maintaining accurate phase compensation. To validate the proposed method, a millimeter-wave ultra-wideband high-efficiency DPA was fabricated using a 0.15-μm GaN process. Measurement results demonstrate that, over the 24~33 GHz frequency band, the fabricated chip achieves a small-signal gain of 21.8~23.8 dB, a saturated output power of 28.9~31.0 dBm, a saturated PAE of 25.2%~33.5%, and a 6 dB back-off PAE of 15.5%~19.8%. Compared with previously reported GaN DPAs operating in similar frequency bands, the proposed design achieves a maximum relative bandwidth of 31.6%, the highest reported small-signal gain and saturated PAE, high saturated output power, and high 6 dB back-off PAE, while occupying the smallest chip area among reported two- and three-stage DPA MMICs. These measurement results validate the proposed method and demonstrate its strong potential for millimeter-wave satellite communication transmitters. -
表 1 与目前报道的毫米波GaN DPA MMIC性能对比表
参考
文献频率
(GHz)相对带宽(%) 级数 Psat
(dBm)增益
(dB)PAE(%)
@PsatPAE(%)@
6 dB PBO芯片面积(mm2) 年份 所采用工艺 [11] 24~28 15.4 2 36.8~38.1 16.4~20.0 29.7~36.8 18.6~32a 7.44 2024 0.15 μm GaN [15] 24~28 15.4 2 35.4~36.0 14.9~19.7 27.8~36.8 18.1~30.1 5.95 2022 0.15 μm GaN [16] 24~30 22.2 2 31.6~32.7 9.8~14.9 20~27.6 18.2~22.4 6.30 2025 0.12 μm GaN [17] 24~29 18.9 2 34.8~36.1 15.7~19.5 25~31.7 19.0~24.8 5.32 2024 0.15 μm GaN [18] 28~29.5 5.2 3 34.6 13 24 21 11.78 2024 0.15 μm GaN [19] 29.1 - 1 30.0 9 44 28 5.38 2021 0.15 μm GaN 本文 24~33 31.6 3 28.9~31.0 21.8~23.8 25.2~33.5 15.5~19.8 4.05 2026 0.15 μm GaN 注:a:8 dB回退效率 -
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