玻璃基底上烧结镍导线的工艺
TECHNOLOGY OF SINTERING THE LEADING WIRE ON THE GLASS SUBSTRATE AND ITS STRUCTURE
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摘要: 正 (一)引言 用银镜法、银膏烧结法,在玻璃基底上制做银导电层是较成熟的方法,如(1)导线用欧姆接触引出,此法常有接触不良和滑动现象;(2)导线用焊锡焊接引出,此法不清洁,经受不住真空烘烤,且成品率低;(3)导线用金属粉末加低熔点玻璃焊料做粘接剂固定引出,此法导电层表面粗糙、连接也不牢。 某些电真空器件要求引出导线在制成之后,能经受烧氢处理和真空烘烤;要求加引出导线后导电层清洁、光滑、密实;要求制做引出导线的方法能适应器件的复杂形状。 为了满足这些要求,我们在玻璃基底上一次烧结银导电层和引出导线。这种方法工
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Abstract: A technology is presented by which silver cream is sintered on a glass substrate so that a compact bright silver layer is formed and at the same time a nickel wire is agglutinated on the glass substrate. The technical process is analysed and the silvernickel interfacial layer is observed by means of Auger electron speetroscopy. The technology is suitable for some specific vacuum devices. Experiments show that a silver layer can firmly combine with nickel wire or mesh. -
正交试验设计法,上海市科学技术交流站组编,1975年,第51页. -
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