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基于金属销钉封装的Ka波段固态功率放大模块研究

孙健健 徐建华 成海峰 祝庆霖 韩煦

孙健健, 徐建华, 成海峰, 祝庆霖, 韩煦. 基于金属销钉封装的Ka波段固态功率放大模块研究[J]. 电子与信息学报, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
引用本文: 孙健健, 徐建华, 成海峰, 祝庆霖, 韩煦. 基于金属销钉封装的Ka波段固态功率放大模块研究[J]. 电子与信息学报, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
Citation: Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791

基于金属销钉封装的Ka波段固态功率放大模块研究

doi: 10.11999/JEIT190791
详细信息
    作者简介:

    孙健健:男,1993年生,硕士,研究方向为微波毫米波电路

    徐建华:男,1977年生,高级工程师,主要研究方向为微波毫米波电路

    成海峰:男,1983年生,高级工程师,主要研究方向为微波毫米波电路

    祝庆霖:男,1989年生,工程师,主要研究方向为微波毫米波电路

    韩煦:男,1985年生,高级工程师,主要研究方向为微波毫米波电路

    通讯作者:

    徐建华 xu_jh55suo@163.com

  • 中图分类号: TN772

Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails

  • 摘要: 为了抑制一定频带内的平行板和腔体谐振模式,提高功率放大器工作的稳定性。该文提出了一种人工磁导体(AMC)边界作为腔体封装的Ka波段固态功率放大模块。人工磁导体边界通过周期性金属销钉构成的电磁带隙(EBG)抑制结构实现。对Ka波段固态功率模块进行了设计、加工、装配和测试。由仿真和测试得到的S参数数据,详细地评估讨论了该封装的性能。通过对比其他封装结构,功率模块的无源测试结果证明金属销钉封装可以有效抑制腔体谐振,提高功放模块隔离度。功率模块的有源功率测试则表明金属销钉封装不会影响放大器输出功率。
  • 图  1  传统金属平板封装Ka波段固态功率模块3维模型

    图  2  波导到微带探针过渡尺寸

    图  3  波导到微带探针过渡结构S参数仿真结果

    图  4  Ka波段功放模块销钉封装结构

    图  5  销钉阵列平行面波导结构(剖面图)

    图  6  无限大销钉阵列平行面波导结构色散曲线

    图  7  Ka波段功率模块实物

    图  8  装配了石英探针的功率模块S参数仿真与测试结果

    图  9  金属销钉高度d参数扫描仿真结果

    图  10  包含芯片槽和不含芯片槽腔体S参数仿真结果

    图  11  Ka波段功率模块S参数测试结果

    图  12  3种封装下Ka波段功率模块饱和输出功率测试结果

    表  1  封装腔体本征模谐振频率仿真结果(GHz)

    包含销钉阵列不含销钉阵列
    25.131.8
    25.542.3
    26.752.8
    27.554.6
    49.856.4
    52.557.7
    下载: 导出CSV
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出版历程
  • 收稿日期:  2019-10-16
  • 修回日期:  2020-05-24
  • 网络出版日期:  2020-07-14
  • 刊出日期:  2020-12-08

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